Images are for reference only.
See Product Specifications for product details.
| Part Number | 808-AG11D-LF |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 25.0µin (0.63µm) |
| Contact Material - Post | Copper |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature | -55°C ~ 105°C |
| Image | Part Number | Manufacturers | Description | In Stock | View | |
|---|---|---|---|---|---|---|
 |
808-0043 | GainSpan Corporation | EVAL BOARD FOR GS2011MIE | - | 3 | Details |
 |
808-0044 | GainSpan Corporation | EVAL BOARD FOR GS2100MIE | - | 4 | Details |
 |
808-0045 | GainSpan Corporation | EVAL BOARD FOR GS2011MIZ | - | 4 | Details |
 |
808-0050 | GainSpan Corporation | EVAL BOARD FOR GS2011MIES | - | 2 | Details |
 |
808-0051 | GainSpan Corporation | EVAL BOARD FOR GS2100MIP | - | 6 | Details |
 |
808-0052 | GainSpan Corporation | ADAPTER BOARD WI-FI PMOD | - | 11 | Details |
 |
808-0055 | GainSpan Corporation | EVAL BOARD FOR GS2011MIPS | - | 0 | Details |
 |
808-0059 | GainSpan Corporation | RF EVAL DEV KITS IEEE 802.11 | - | 15 | Details |
 |
808-0061 | GainSpan Corporation | RF EVAL DEV KIT GS2101MIP | - | 5 | Details |
 |
808-0063 | GainSpan Corporation | EVAL BOARD FOR GS2101M | - | 478 | Details |
|
808-0068 | GainSpan Corporation | EVAL BOARD FOR GS2101MIE | 0 | Details | |
|
808-0072 | GainSpan Corporation | EVAL BOARD 802.11 | - | 0 | Details |