558-10-360M19-001104

BGA SURFACE MOUNT 1.27MM
558-10-360M19-001104 P1
558-10-360M19-001104 P1
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Preci-Dip ~ 558-10-360M19-001104

Part Number
558-10-360M19-001104
Manufacturer
Preci-Dip
Description
BGA SURFACE MOUNT 1.27MM
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data sheet
- 558-10-360M19-001104 PDF online browsing
Family
Sockets for ICs, Transistors
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Product Parameter

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Part Number 558-10-360M19-001104
Part Status Active
Type BGA
Number of Positions or Pins (Grid) 360 (19 x 19)
Pitch - Mating 0.050" (1.27mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10µin (0.25µm)
Contact Material - Mating Brass
Mounting Type Surface Mount
Features Closed Frame
Termination Solder
Pitch - Post 0.050" (1.27mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 10µin (0.25µm)
Contact Material - Post Brass
Housing Material FR4 Epoxy Glass
Operating Temperature -55°C ~ 125°C

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