Samsung memory tends to monopolize, with a share of 43% in the second quarter, mass production of 8-layer DDR5 memory in 2022

Samsung Electronics said at the chip industry conference this Monday that Samsung Electronics will mass produce 8-layer DDR5 memory by the end of next year.
It will use TSV technology for 512GB DDR5 memory modules. Samsung has previously used 4-layer TSV technology for DDR4, making the chip only 1.2 mm thick, while the new 8-layer DDR5 module will be thinner than 1 mm.

Samsung has been using thinner wafer processing technology in recent years to reduce the distance between chips.
Samsung said that compared to DDR4, the new DDR5 will have a better heat dissipation function, thanks to the application of high-K materials. At the same time, it has applied its own power management IC to reduce noise and has a lower voltage.
DDR5 will have a data transmission speed of 7.2Gbps, and Samsung has applied a technology called a decision feedback equalizer to increase the data transmission rate and maintain a stable signal.
Samsung said that the new memory modules will target the data center and server markets.
Samsung plans to invest 240 trillion won (approximately US$205 billion) in the semiconductor industry in the next three years, of which memory will be one of the key projects, including DRAM focused on 14nm and more advanced technology manufacturing, and the development of NAND flash memory with more than 200 layers. And enhance the memory production line.

Lscssh technology officer's point of view: Samsung's memory market can be described as a monopoly at present, with a 43.6% share (as of the second quarter of 2021), and a single quarter revenue of more than 10 billion US dollars. This may be one of the main reasons why Samsung wants to further strengthen its investment in memory!