Laser Additive Manufacturing (LAM) technology has unique processing advantages, enabling the manufacture of difficult-to-machine metals (titanium alloys, superalloys, etc.), breaking through the structural constraints of parts, and processing and manufacturing of complex and difficult-to-machine parts. Laser applications have received widespread attention. Compared to traditional processing modes, this “bottom-up” manufacturing technique, which involves material accumulation, has brought many breakthroughs, making it possible to manufacture complex structures that were previously impossible.

The kilowatt-class direct semiconductor laser has the advantages of low loss, compact structure, high electro-optic conversion efficiency, easy automation and low cost, and has obvious advantages in the application of additive manufacturing, making it an ideal choice for additive manufacturing applications.

Laser Additive Manufacturing (LAM) technology has unique processing advantages, enabling the manufacture of difficult-to-machine metals (titanium alloys, superalloys, etc.), breaking through the structural constraints of parts, and processing and manufacturing of complex and difficult-to-machine parts. Laser applications have received widespread attention. Compared to traditional processing modes, this “bottom-up” manufacturing technique, which involves material accumulation, has brought many breakthroughs, making it possible to manufacture complex structures that were previously impossible.

The kilowatt-class direct semiconductor laser has the advantages of low loss, compact structure, high electro-optic conversion efficiency, easy automation and low cost, and has obvious advantages in the application of additive manufacturing, making it an ideal choice for additive manufacturing applications.

Application of Huaguang Optoelectronic Direct Semiconductor Laser System in Cladding

With its rich experience and solid technical foundation in the field of semiconductor lasers, Huaguang Optoelectronics has successfully developed high-power chip packaging, optical bundling and fiber coupling, etc. based on the core advantages of self-produced high-power chips. Direct semiconductor laser system with output power covering 1000 watts to 10,000 watts and optical fiber output. The product can be applied to the fields of laser cladding, surface treatment, welding, etc., and has been partially put into the market.

Application of Huaguang Optoelectronic Direct Semiconductor Laser System in Cladding

With its rich experience and solid technical foundation in the field of semiconductor lasers, Huaguang Optoelectronics has successfully developed high-power chip packaging, optical bundling and fiber coupling, etc. based on the core advantages of self-produced high-power chips. Direct semiconductor laser system with output power covering 1000 watts to 10,000 watts and optical fiber output. The product can be applied to the fields of laser cladding, surface treatment, welding, etc., and has been partially put into the market.